重磅发布|光羽芯辰全球首发端侧大算力3D近存算AI芯片TC1000系列
Quick Answer
Guangyu Xincheng has launched the TC1000 series, the world's first 3D stacked near-memory AI chip, at WAIC 2026.
Quick Take
This chip offers a tenfold increase in equivalent bandwidth and operates at one-third the power consumption, achieving 300 tokens per second inference for a 3B model.
Key Points
- TC1000 series features 10x increase in equivalent bandwidth.
- Power consumption reduced to one-third of previous models.
- Achieves 300 tokens per second inference for 3B models.
- First chip of its kind to utilize 3D stacking technology.
- Targets advancements in applications.
Article Excerpt
From source RSS / original summary光羽芯辰在WAIC 2026发布全球首款端侧3D堆叠近存算芯片TC1000系列,以等效带宽10倍提升、功耗仅1/3的突破性性能,实现单芯片3B模型300token/s推理,
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The 2026 Global AI Chip Summit will take place in Shanghai on September 22-23, focusing on the evolving AI chip landscape, including the shift from training to inference, the rise of diverse chip technologies, and the restructuring of industry competition. Notable speakers include experts from leading universities and companies, discussing advancements in AI chip architecture and applications.