重磅发布|光羽芯辰全球首发端侧大算力3D近存算AI芯片TC1000系列
Quick Answer
Guangyu Xincheng has launched the TC1000 series, the world's first 3D stacked near-memory AI chip, at WAIC 2026.
Quick Take
This chip offers a tenfold increase in equivalent bandwidth and operates at one-third the power consumption, achieving 300 tokens per second inference for a 3B model.
Key Points
- TC1000 series features 10x increase in equivalent bandwidth.
- Power consumption reduced to one-third of previous models.
- Achieves 300 tokens per second inference for 3B models.
- First chip of its kind to utilize 3D stacking technology.
- Targets advancements in applications.
Source Excerpt
光羽芯辰在WAIC 2026发布全球首款端侧3D堆叠近存算芯片TC1000系列,以等效带宽10倍提升、功耗仅1/3的突破性性能,实现单芯片3B模型300token/s推理,
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