为明年Rubin Ultra 准备的Kyber NVL144 机柜架构，可能 ...
Quick Answer
NVIDIA's Rubin Ultra may face over a year delay due to manufacturing complexities with the Kyber NVL144 cabinet architecture, while TSMC expands its advanced packaging facilities, indicating strong AI demand despite challenges.
Quick Take
The shift in Rubin Ultra's design could affect the number of dies and overall performance, impacting future product timelines.
Key Points
- Rubin Ultra's production may be delayed over 12 months due to PCB manufacturing challenges.
- TSMC is adding two advanced packaging plants, raising total to four in Taiwan.
- NVIDIA's design changes may reduce die count, impacting performance and production timelines.
- Current demand for HBM4 remains strong despite Rubin Ultra's potential delays.
- AI industry's growth faces challenges in packaging technology and supply chain efficiency.
Source Excerpt
台积电再建两座先进封装厂，Rubin Ultra 的真相更清楚
前几天我写了一篇：Rubin Ultra 延期， $NVDA 和黄仁勋可能正在撞击 AI 机柜的物理极限。
SemiAnalysis 爆料，为明年 Rubin Ultra 准备的 Kyber NVL144 机柜架构，可能因为超复杂 PCB 中板的制造难度，被推迟超过12个月，延后到后年。
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