上海硅光芯片龙头冲刺科创板！毛利率比源杰科技还高，拟募资24.3亿 - 智东西
Quick Answer
Shanghai-based Xihe Technology is set to launch an IPO on the Sci-Tech Innovation Board, aiming to raise 2.43 billion CNY.
Quick Take
Shanghai-based Xihe Technology is set to launch an IPO on the Sci-Tech Innovation Board, aiming to raise 2.43 billion CNY. The company, specializing in high-performance silicon photonic chips, projects a revenue of 461 million CNY by 2025, with a remarkable CAGR of 760.34% and a net profit turnaround to 176 million CNY.
Key Points
- Xihe Technology's IPO is accepted, targeting 2.43 billion CNY in fundraising.
- The company anticipates a revenue of 461 million CNY by 2025, up 549% year-over-year.
- Projected global market share for silicon photonic chips is approximately 13% by 2025.
- Xihe's net profit is expected to reach 176 million CNY in 2025, reversing previous losses.
- The funds will enhance AI computing power and data center capabilities.
Article Excerpt
From source RSS / original summary快讯 头条 人工智能 芯东西 AIoT 云与智慧城市 机器人 VR/AR 手机通信 活动. 芯东西7月1日报道，6月30日，上海高性能硅光集成芯片设计公司**羲禾科技**科创板IPO获受理。. 羲禾科技成立于2021年5月，由山东籍中科院博士武爱民创办，是国家级专精特新“小巨人”企业，主要产品为高性能硅光集成芯片，产品速率覆盖**400G、800G及1. 6T**，并已拓展**3. 2T及6. 4T NPO/CPO**收发集成芯片。. 招股书显示，2025年，羲禾科技营收为4. 61亿元，同比增长**549%**；净利润为1. 76亿元，去年同期为-0. 22亿元。. 根据弗若斯特沙利文数据，2025年，羲禾科技硅光集成芯片全球市场占有率约为**13%**，是**全球头部硅光集成芯片厂商**，亦是**全球最主要的独立第三方硅光集成芯片设计公司之一**。. 该公司最近一次外部融资于2025年12月完成，此次融资3. 51亿元，投后估值**37亿元**。. 本次IPO，羲禾科技拟募资**24.
30亿元**，用于AI算力及数据中心硅光集成芯片产业化能力提升项目、下一代硅光集成芯片研发及产业化项目、研发中心建设项目及补充流动资金。. ## **一、三年营收复合增长率高达760. 34%，2025年扭亏为盈**. 硅光集成正在当前算力基础设施建设中成为主流光互连方案，同时成为NPO、CPO、OIO下一代光互连架构的核心技术底座，并逐步向自动驾驶、可穿戴设备、工业及医疗等多元化场景拓展。. 2023年、2024年、2025年，羲禾科技营收分别为622. 70万元、0. 71亿元、4. 61亿元，复合增长率高达760. 34%；净利润分别为-0. 28亿元、-0. 22亿元、1. 76亿元；研发费用分别为0. 36亿元、0. 45亿元、0. 63亿元。. ▲2023年~2025年羲禾科技营收、净利润、研发支出变化（芯东
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