这届 IROS 2026 上,具身学术与产业边界正在消融 | 雷峰网
Quick Answer
IROS 2026 reveals a shift in embodied AI, emphasizing physical understanding over semantic fitting.
Quick Take
Key trends include the integration of physical laws in models, the establishment of 'big and small brain' architectures as standards, and the critical role of touch in dexterous manipulation, with significant advancements in data collection methods reducing costs and improving efficiency.
Key Points
- Physical laws must be internalized in models, shifting focus from semantic to physical correctness.
- The 'big and small brain' architecture is now a standard for real-time robotic control.
- Touch is becoming essential for dexterous manipulation, as visual limitations are increasingly recognized.
- New data collection methods, like the lightweight ViHaTeleop, significantly reduce costs and improve efficiency.
- Chinese teams are gaining prominence, contributing innovative solutions and frameworks in .
📖 Reader Mode
~4 min read
作者丨齐铖湧
编辑丨岑 峰

01
具身基模:别再 “语义拟合” 了,得懂物理







02
“大小脑” 架构:
今年终于成了机器人顶会标配




03
触觉,终于坐上顶会正桌了




04
顶会不仅在关注数据采集,
并且找到了 “新平替”

05
总结:
工程落地,已经成为顶会新风向


为了方便大家抱团交流、互通会议消息,我们专门建了 IROS 2026 参会交流群!进群你会解锁这些「福利」?
会议情报站:投稿 DDL、格式规范、评审进度……关键节点第一时间送达,再也不怕错过 deadline,投稿准备稳稳的。
同行茶话会:天南海北的同行都在群里,聊心得、碰思路、攒人脉,科研路上我们同行。
前沿补给站:最新研究成果、热点方向实时同步,结合会议主题帮你捋清投稿脉络,给论文灵感加满油。
现场后援团:(会议期间专属开启):到了会场也不用慌——
路线导航:场馆分布、报告厅怎么走,群里随时问;
议题共读:热门 session、Keynote 探讨,错过也能追;
Poster 汇编:现场海报精华整理,一键收藏不遗漏;
约局广场:约饭局、采访局、交流局……想唠嗑、想合作、想面基,群里发起就成。
? 进群传送门: 扫码进群或添加微信Luyoyo_2026,备注:ECCV + 单位/学校+姓名+方向。

搞科研/搞技术,信息差很重要。
来,一起快人一步!

上车,带你看遍全球 AI 顶会精华
可独家畅览:
专家演讲PPT
大会报告全文
热门论文解读
学术新星访谈

扫描上方二维码
或点击「阅读原文」关注专区。
— Originally published at m.leiphone.com
Want this in your inbox every morning?
Daily brief at your local 8am — bilingual EN/中文, free.
More from WebSearch (Tavily)
See more →全球AI芯片峰会,9月上海见!
The 2026 Global AI Chip Summit will take place in Shanghai on September 22-23, focusing on the evolving AI chip landscape, including the shift from training to inference, the rise of diverse chip technologies, and the restructuring of industry competition. Notable speakers include experts from leading universities and companies, discussing advancements in AI chip architecture and applications.